Author: Connected World

Across the industrial, ProAV, automotive, and other key sectors, we are seeing businesses turn their attentions toward converged networking for integrating IT (information technology) and OT (operational technology). These are integral to support realtime applications and optimized operations. Combining wired and wireless connectivity with enhancements for deterministic and realtime performance, converged networks allow for easy integration and co-existence of device types and applications with mixed-criticality requirements. TSN (time sensitive networking) standards define capabilities to enable converged networks where time-critical data is delivered seamlessly to different devices with determinism, co-existing with other traffic types on the same network. As a result,…

Read More

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth, according to a recent report from IDTechEx. In the realm of 3D integration, microbump technology continues to advance for achieving smaller pitches, with groundbreaking Cu-Cu connection methods like hybrid bonding leading the way. Here is how this can help: Power efficiency is enhanced through innovative packaging techniques. Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration’s smaller z-form factor. Cost reduction strategies involve…

Read More