Author: Connected World
ABI Research says the manufacturing industry will reach 108 million private cellular IoT connections in 2030.
Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth, according to a recent report from IDTechEx. In the realm of 3D integration, microbump technology continues to advance for achieving smaller pitches, with groundbreaking Cu-Cu connection methods like hybrid bonding leading the way. Here is how this can help: Power efficiency is enhanced through innovative packaging techniques. Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration’s smaller z-form factor. Cost reduction strategies involve…
GlobalData says APAC automotive active and passive safety systems market will expand at a 2.6% rate between 2023 and 2028.
Juniper Research says operators will invest more than $200 billion globally in cloud network services in the next four years to meet demand for cellular data.
IDC says data management workloads led spending on compute and enterprise storage systems in the second half of 2023 while AI lifecycle gained traction.
Gartner says gen AI is now the most frequently deployed AI solution in organizations.
Robotic technologies can help in several ways and in many different industries. Today, let’s consider how it can assist in packaging. As one example, Superior Paving Corp., has announced a robotic arm that packages 50 pound bags of EZ Street, which is an asphalt solutions company. The robotic solution is part of Superior Paving’s plan to adopt Ambient Asphalt Technology by EZ Street, which will ultimately lead to durability and sustainability in road maintenance. Here is how this can help: Enhance operations for greater productivity. Enhance safety to improve conditions for workers. Allow people to focus on more critical aspects…
Forrester says global IT service industry spend will reach $2 trillion by 2028.
GlobalData says gen AI emerges as key theme in companies’ discussion in Q1 2024.
Juniper Research says instant payment transactions to surpass $58 trillion globally by 2028.