Author: Connected World
Rebuilding infrastructure isn’t a small task—but technology can help speed up processes. Consider the example of underground infrastructure. It can be difficult to find and locate metal and nonmetal pipes, conduits, communication cables, and more that lies under the ground. However, with GPS (global positioning system) and GNSS (global navigation satellite system), there are new opportunities to find it accurately. As one example, Radiodetection recently decided to use Point One Navigation’s Polaris in the launch of its new survey-grade precision utility locator, the RD8200SG. With this, utility workers and contractors can monitor underground assets with precision locating and survey-grade accuracy.…
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Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth, according to a recent report from IDTechEx. In the realm of 3D integration, microbump technology continues to advance for achieving smaller pitches, with groundbreaking Cu-Cu connection methods like hybrid bonding leading the way. Here is how this can help: Power efficiency is enhanced through innovative packaging techniques. Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration’s smaller z-form factor. Cost reduction strategies involve…
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