#Factoftheweek
15-fold growth.
The opportunities are endless with AI (artificial intelligence), but only if the technology can handle the workload, right?
This is still a challenge, especially as the amount of data continues to grow exponentially.
Have you hit that memory wall?
Parallel-computer architectures, such as those deployed for modern high-performance computing and artificial-intelligence workloads, often encounter memory bottlenecks that limit performance.
IDTechEx says this has stemmed from the advances in processor performance outpacing developments in memory performance.
Enter high-bandwidth memory.
HBM is a 3D structure of vertically stacked DRAM dies on top of a logic die and relies on advanced packaging technologies such as through silicon vias (TSVs) and uses silicon interposer for interconnection with the processor.
IDTechEx predicts unit sales of high-bandwidth memory will grow 15-fold by 2035 compared to 2024.
Of course, there are challenges.
What roadblocks have you hit when trying to do something new with artificial intelligence? What solutions exist that can help? Or what innovation could drive these opportunities?
View this story on LinkedIn.